Focus on Indo-Japan ties in embedded, design and automotive
Recently, the India Semiconductor Association (ISA), in collaboration with Japan External Trade Organization JETRO, recently took a business delegation to Fukuoka, Japan, on November 11-13, 2009, to promote the Indian embedded, automotive and design companies, and to attend the 9th International Workshop on Microelectronics Assembling and Packaging (MAP 2009).
Indian electronics industry
During the inaugural session, N. Krishnan, director, STPI, and leader of the Indian delegation, made a presentation on “Electronics Industry in India-an Overview”.
According to him, the Indian electronics industry is on a growth path. The domestic production is at $20 billion in 2008-09 and exports at $4 billion, representing a growth of 21 percent over the previous year. All the global top 10 fabless design companies have India operations and 22 of the top 25 semicon companies have design/development centers.
India is now emerging as a preferred destination for manufacturing. A good electronics ecosystem is building up and there is a shift to increased local value addition. He also touched upon the highlights of the Indian semiconductor policy. These include:
* The government will bear 20 percent of the capital expenditure during the first 10 years for units located inside SEZs and 25 percent for those outside it. Window open till March 2010.
* For semiconductor manufacturing (wafer fabs) plants, the policy proposes a minimum investment of $625 million and $220 million for ecosystem units, including ATMP.
* There is a ceiling of three fab units and 10 ecosystem units for incentives under the policy.
* Key benefit is the grant of the SEZ status.
* There has been an overwhelming response to the Government’s policy – 17 proposals have been received envisaging an investment of $35 billion, with 15 proposals received relating to solar PV manufacturing.
* Government of India has given in-principle approval to 12 proposals.
* There is a great opportunity to leverage the policy incentives for ATMP operations.
Advantages of outsourcing to India
Krishnan highlighted the SEZ incentives, which includes no license required for import, exemption from customs duty on import of capital goods, raw materials, consumables, spares, etc., exemption from central excise duty on procurement of capital goods, raw materials, consumable spares etc. from the domestic market, supplies from DTA to SEZ units treated as deemed exports, reimbursement of central sales tax paid on domestic purchases, etc.
What about the advantages of outsourcing to India? According to him, these include an overall 7-10 cost reduction compared to the current scenario, as well as assembling only when required and building products that are required, so there is no waste.
India is already a proven case for IP, embedded systems and IC design, besides boasting of a skilled employee base and strong R&D capabilities. All of these provide Japanese companies a major opportunity to reduce cost and improve customer satisfaction.
India rising on global stage
The second day of MAP 2009 featured a host of presentations from the ISA-led Indian delegation during the India Session.
Ms Poornima Shenoy, president, ISA, spoke at length about India’s status as a rising player in the world electronics design stage. She touched upon the strength of the country’s semiconductor design industry, which is increasing witnessing a growing role of the independent design companies (IDCs). These IDCs provide flexible business models for design engagement. They are involved primarily in front end design work, providing testing and verification-level services, and continue to mature in terms of experience and capabilities.
The growth in India’s IC design industry is being driven by global corporations who are establishing captive design centers or expanding their existing design capacity in India. The Indian design companies are therefore moving up the value chain. There is a high level of maturity in product engineering and development, and project management expertise. India’s IC design industry is particularly strong in important market segments such as wireless, automotive and consumer electronics.
Some challenges currently faced by India include a talent crunch at the middle-level technical and managerial level, resulting in attrition, rising cost of staff, competition from other design destinations such as Eastern Europe, the Middle East, China and Israel, and the absence of commercial semiconductor fabs in India.
She added: “India has the potential to address the challenges mentioned earlier and grow as the preferred outsourcing/off shoring destination for semiconductor companies. We invite Japanese companies to leverage India’s strengths and avail of this opportunity.”
India Semiconductor Vision – ISV 2020
Dr. Pradip K. Dutta, Corporate Vice President & Managing Director, Synopsys India, presented the India Semiconductor Vision – ISV 2020. This vision includes:
* Focus semiconductor and related enabling technologies on new growth markets critical to India’s needs such as healthcare, renewable energy.
* Lead in new technologies by focusing device manufacturing and ATMP on new component technologies, e.g., MEMS/PV and nanomaterials.
* Fund and guide research through industry/academia/government consortium, using market specific technology roadmaps.
* Some focus areas of the ISV2020 include promoting IP vendors, developing more fabless semiconductor companies, focus on ATMPs and material suppliers, and promote more of ODM/EMS and board design services. Dr Dutta also projected a forecast of India’s electronics industry by segment up to 2020 (see table below).
Kuttappa Bittiananda, Practice Manager – Semiconductor & System Design, Wipro Japan discussed how delivery challenges could be bridged in Japan. EAGLEWISION is Wipro’s design methodology for LSI, FPGA and board designs.The methodology aims to deliver cost effective and high quality designs through guidance, scrutiny, automation and re-use. The methodology focuses on prevention, detection and early correction.
Tetsuya Tsuruta, Patni Computer Systems Ltd, made a presentation titled: Exploring Business opportunities for Kyushu in collaboration with Indian partners. He spoke about the role of green embedded technologies (ET) in the semiconductor value chain. Green ET means a chance — where product re-engineering is required.
For instance, minimizing the form factor and components on the module helps in the reduction of PFC gas emission drastically. Also, ASIC/PFGA/SoC design and software/firmware are required for not only reducing the semiconductor pitch, but also re-engineering of the circuit.
Tsuruta added that re-engineering requires close communication with existing Japanese engineers at the first stage. The domain knowledge for new green devices is required as well.
Leave a comment Cancel reply
Recent Posts
- MIPS driving Android to digital home @ Computex 2011!
- Tablets likely to transform ICT industry landscape: Computex 2011
- Embedded Vision Alliance (EVA) is born!
- Where is Indian semiconductor industry headed?
- Kotura leads the way in silicon photonics!
- Heart of dragon beats inside smartest devices: Qualcomm
- Evolution of wireless market and emerging trends: Qualcomm
- Renesas Mobile inaugurates R&D centre in Bangalore
- Indian semicon market update shows 28.3 percent growth in 2010!
- Reliving 9/11! I am numbed!!
Categories
- 22nm
- 32nm
- 3G
- 3G spectrum
- 40nm
- 450mm
- 45nm
- 4G
- 65nm
- 802.11n
- 90nm
- A.Raja
- Aart De Geus
- Abhi Talwalkar
- Accellera
- Accenture
- access control
- Agilent
- Altera
- Aluminum electrolytic capacitors
- AMD
- AMS
- Analog Devices
- analog ICs
- analog mixed signal
- analog/RF
- analog/RF competency center
- Anand Chandrasekher
- Anil Gupta
- Ankush Oberai
- Apple
- Apple TV
- Applied Materials
- AqTronics
- ARIB
- ARM
- Asia
- Asiaworld Expo
- ASICs
- ASML
- ASPs
- ASSPs
- ASUS
- Atom
- Atom processor
- AUSPI
- automotive
- automotive electronics
- Bali
- bandwidth costs
- Bangalore
- Bangalore Nano 2007
- Bangalore serial blasts of July 25
- Bangkok
- Barack Obama
- Beagle Board
- Beceem
- Beijing Olympics
- Belliappa Kuttanna
- biometrics
- BIPV
- Blackberry
- Blade.org
- bloggers
- Blogging
- blogs
- board design
- Bosch Sensortec
- Brazil
- Brent Przybus
- Broadband
- Broadcom
- building integrated photovoltaics
- BV Naidu
- C++
- C-DoT
- C-to-Silicon Compiler
- Cadence
- Calpella
- carrier Ethernet
- CDG
- CDMA
- CDMA Development Group
- CDMA2000
- CDNLive
- CEA
- CEATEC
- cell phones
- Cellworks
- Charlie Hartley
- Chartered Semiconductor
- Chelsio
- Chi-Foon Chan
- Chimera
- China
- China Mobile
- China Sourcing Fair
- China Telecom
- China's IC industry
- China/Hong Kong
- Chinese semiconductor industry
- chip design
- chip designers
- Chip fabs
- chip industry
- chip makers
- chip market
- chip suppliers
- chips
- Christian Gregor Dieseldorff
- CIOL
- CIOs
- Cir-Q-Tech
- cloud computing
- CMOS
- CMOS camera modules
- CMP
- co-verification tools
- COAI
- communications
- components
- COMPUTEX
- Computex Taipei
- computing
- connectors
- consumer electronics
- Converge Market Insights
- convergence
- converter solution
- Core i7 processor
- Corporate Social Responsibility
- Cosmic Circuits
- Cowans LRA model
- CPF
- CPLD
- CPM
- cross-license dispute
- cross-licensing
- crystalline solar
- CSF
- CSR
- Cuil
- CustomSim
- CWG
- Cyclone III LS
- Cypress
- Cypress Semiconductor
- DAB
- DAB radios
- Dale Ford
- data center energy measurement
- Datang
- DAVIC
- DECT
- Deloitte
- Delphi FormFactor
- Denali
- Department of IT
- Derek Lidow
- design challenges
- design services
- design services in India
- design tools
- designers
- developers
- Dexcel Electronics Designs
- DFM
- DFT
- Diachi
- digital cameras
- digital factory
- digital president
- digital still cameras
- Digitimes
- DISCO
- Discovery 2009
- disk drive controllers
- display driver ICs
- display drivers
- displays
- DisplaySearch
- DLNA
- DLP
- Dr Farooq Abdullah
- Dr Gordon Moore
- Dr. Ashok Das
- Dr. Bobby Mitra
- Dr. Chi Foon-Chan
- Dr. Ganesh Natarajan
- Dr. Henning Wicht
- Dr. J. Gururaja
- Dr. Li Shi-he
- Dr. Madhusudan V. Atre
- Dr. Rajiv Jain
- Dr. Robert N. Castellano
- DRAM
- DRAM industry
- DRAM manufacturers
- DRAM market
- DRAMeXchange
- DRC/LVS
- driver ICs
- drug discovery
- DSOA
- DSPs
- DTG
- DTH
- DTV
- Dubai
- Dubai Circuit Design
- Durga Puja
- E Ink
- e-book semiconductors
- E-books
- e-passports
- ebooks
- EC
- EC ruling
- ECG-on-a-Chip
- Eclypse
- EDA
- EDA Consortium
- EDA industry
- EDA products
- EDA tools
- EDGE
- EEPROMs
- eInfochips
- Elcoteq
- Elections 2009
- electronic components
- electronic design engineers
- Electronic Design Trends
- electronic designers
- electronic equipment
- electronic paper display
- electronics
- electronics components
- Electronics Hardware
- Electronics industry
- electronics products
- electronics supply chain
- Electronics Weekly
- Electrophoretic Display
- element14
- Elpida
- embedded
- embedded applications
- embedded computing
- embedded design
- embedded designers
- embedded devices
- embedded Internet
- Embedded Internet devices
- embedded jobs
- embedded Linux
- embedded processor
- embedded software
- embedded systems
- embedded systems and software
- EmSys
- emulator
- Encounter
- Encounter Digital Implementation
- energy
- energy efficiency
- Enterprise
- enterprise technologies
- enterprise verification
- Enterprises
- epaper
- EPD
- Epson Toyocom
- EPSRC
- ESL
- Ethernet
- EU
- Europartners
- European Commission
- EV-DO Rev. A
- EVE
- Extreme Networks
- fab capacities
- fab policy
- fab spends
- Fab-Lite
- FabCity
- fabless
- fabless companies
- Fabless Semiconductor Association
- fabs
- Fabtech
- Farnell
- FDSOI
- femtocells
- First Solar
- fixed-mobile convergence
- flash memory
- flexible displays
- flexible substrates
- Flextronics
- FMC
- FOMA
- Forward Concepts
- foundries
- foundry semiconductor market
- FPDs
- FPGA
- FPGA Central
- FPGA design
- FPGA design software
- FPGA market
- FPGA Seek
- FPGAs
- France
- Freescale
- Freescale Technology Forum
- Frost
- FTF 2008
- Fujicon
- Fujitsu
- Fukuoka
- Fully Depleted Silicon On Insulator
- Future Horizons
- G1
- Galaxy Custom Designer
- Gartner
- Garuda
- Gary Shapiro
- GateRocket
- GE Healthcare
- Germany
- Gigabyte
- GK Pramod
- global chip market
- global DRAM market
- global EDA industry
- global MEMS market
- global semiconductor industry
- global semiconductor inventory
- global semiconductor manufacturing industry. global semiconductor industry
- Global semiconductor manufacturing utilization
- global semiconductor market
- Global silicon photonics market
- global solar industry
- Global Sources
- global telecom industry
- GlobalFoundries
- Google phone
- Gordon Moore
- GPS
- graphical programming
- graphical system design
- green data centers
- green electronics
- GSA
- GSM
- Gurdas Kamat
- Hanns Windele
- HardCopy IV ASICs
- hardware
- hardware policy
- hardware/software co-verification
- hardware/software co-verification solutions
- Harriet Green
- Harshad Deshpande
- HDDs
- HDMI
- healthcare
- High-definition
- high-K gate dielectric
- high-K metal gates
- high-level synthesis
- Hitachi
- HKMG
- HLS
- Hokoriku
- Hon Hai
- HSMC
- HSPA
- HTC
- Huawei
- hybrid car
- Hynix
- i-mode phones
- i-phones
- IBM
- IBM Research Labs
- IC ASPs
- IC industry
- IC Insights
- IC market
- IC Validator
- ICICI Ventures
- ICs
- IDC
- Idea Cellular
- IDF
- IDF Taiwan
- IDM
- iDTV
- IEF 2009
- IIM-Bangalore
- IISc. Bangalore
- IIT Bombay
- IIT Kharagpur
- IIT Madras
- IIT-Kanpur
- iMac
- IMS
- IMT
- InCyte Chip Estimator
- India
- India Inc.
- India Semiconductor Association
- India semiconductor market
- India's first plug-in hybrid car
- Indian 3G policy
- Indian aerospace and defense markets
- Indian branded memory market
- Indian EDA industry
- Indian electronics industry
- Indian embedded industry
- Indian fab story
- Indian IT industry
- Indian semicon policy
- Indian semiconductor industry
- Indian solar industry
- Indian solar/PV industry
- Indian telecom
- Indian telecom industry
- Indrion
- industrial segments
- Infineon
- Infineon Asiaworld Expo
- Infosys
- Ingo Guertler
- innovators
- InnovLite
- Inoueki
- integrated access devices
- Intel
- Intel Atom processor
- Intel Core 2 Duo
- Intel Developer Forum
- intelligent video surveillance system
- International Electronics Forum (IEF)
- Internet
- Internet radio stations
- Internet radios
- intranets
- Invensense
- IP creation
- IP re-use
- iPad
- iPDK
- iPhone
- iPhone 3G
- iPod
- IPs
- IPSec
- IPTV
- ISA
- ISA Excite
- ISA Vision Summit 2009
- ISE Design Suite 11
- ISI Calcutta
- Israel
- Istanbul
- iSuppli
- IT
- IT processes
- IT/OA
- Ittiam
- Ittiam Systems
- ITU
- ITU Telecom Asia
- iTV
- IVSS
- James Reinders
- Japan
- Japan chip industry
- Japan's microelectronics industry
- Jaswinder Ahuja
- Jayamahal
- Jayaram Pillai
- Jérémie Bouchaud
- JEM
- Jennifer Lo
- JETRO
- JMCC
- JNCASR
- Jobs in FPGAs and CPLDs
- Jon Cassell
- Jonney Shih
- Jordan Plofsky
- Joseph Sawicki
- K. Subramanya
- Karnataka
- KCR
- Kexin
- Khasim Syed Mohammed
- Kionix
- Kirk Skaugen
- Kishor Patil
- Klaus Maler
- Knowles
- Kochi
- Kodiak Networks
- Korea
- Korea Electronics Show
- KPIT Cummins
- KUKA
- Kyushu
- LabView
- LabView 8.6
- Lanco Solar
- Lara Chamness
- LAS-CDMA
- last mile problem
- Laurin Publishing
- LCD
- LCD monitor panels
- LCD monitors
- LCD panels
- LCD TVs
- LCDs
- LED driver ICs
- LED lighting devices
- LED lights
- LEDs
- Lexmark
- LG
- LG Telecom
- life sciences
- LinkAir
- Linux
- lithography
- Lo Wu
- logic IC market
- logic synthesis
- low power
- low-cost handsets
- low-power design
- LSI Corp.
- LSI Logic
- LTE
- LUT
- Mac OS
- Magma Design Automation
- Malcolm Penn
- malware
- Man Yue
- Manoj Gandhi
- manufacturing hub
- Marco Principato
- Market for key system semiconductors
- Marnello
- material devices
- McAfee
- MCMM
- MCUs
- MEAS
- Measurement Specialties
- Mediacart
- MediaTek
- mega fabs
- MelZoo
- memory
- memory fabs
- memory market
- MEMS
- MEMS accelerometers
- MEMS devices
- MEMS foundries
- MEMS gyroscopes
- MEMS industry
- MEMS oscillators
- MEMS sensors
- Memsic
- Mentor Graphics
- Messe Munchen
- metro area networks
- MHEG-5
- Michael J. Fister
- micro fuel cells
- microcontrollers
- Micron
- Micronics Japan
- microprocessors
- Microsoft
- MIDs
- MII
- MIII
- Mike Cowan
- Mike Splinter
- military
- military market
- Min-Sun Moon
- Minalogic
- mini fabs
- Ministry of Communication and IT
- mixed signal
- ML-PCBs
- MNRE
- Mobile
- Mobile application operating systems
- mobile broadband
- mobile computing
- mobile CPUs
- mobile devices
- mobile handheld devices
- mobile handsets
- mobile Internet
- mobile Internet devices
- mobile phone semiconductor market
- mobile phones
- mobile TV
- mobile VAS
- Mobile WiMAX
- Mobility
- Moblin
- modeling and photomask correction
- monitor panels
- Monolithic Power Systems
- monster fabs
- Moore’s Law
- Moorestown
- MosChip
- Moser Baer
- Moshe Handelsman
- Motorola
- Mouser
- MP3 players
- MPUs
- multi-core platforms
- multi-cores
- multicore programming
- multilayer PCBs
- Mumbaikars
- Munich
- Murata
- N.K. Goyal
- Nader Tadros
- Nam Hyung Kim
- NAND
- NAND flash
- NAND Flash memory
- Nanomanufacturing
- nanoscience
- Nanotechnology
- nanotubes
- Nanya
- National Semiconductor
- Near Field Communication
- NEC
- Neeraj Varma
- Nehalem
- Nehalem-EX
- net-tops
- netbooks
- Netscape
- nettops
- Networking
- NewEra
- next-generation data centers
- NFC
- NI
- NI. LabVIEW 8.5
- NIIT
- Nikon
- Nile
- Nimish Modi
- Ning
- Nintendo Wii
- Nios II processor
- Nishant Sarawgi
- NMI
- Nokia
- NOR
- notebook market
- notebooks
- NTT DoCoMo
- Nuance
- Numonyx
- nVidia
- NXP India
- OEM semiconductor design
- OEMs
- oil prices
- OLED
- OLED driver ICs
- OLEDs
- Open Handset Alliance
- Open Platforms
- Open Silicon
- Open Source
- OpenOffice
- Opera
- optical networking
- optos
- Outlook 2009
- OZ
- PA Semi
- packaging
- PADS 9.0
- Pagemaker
- Palm
- Panasonic
- Parallel computing
- parallel programming
- parallelism
- passives
- Patrice Hamard
- PCB industry
- PCB services
- PCBs
- PCI
- PDAs
- PDPs
- Perry LaForge
- PFI
- pharma
- Philips
- Philips Consumer Lifestyle
- Phoenix Solar
- phonons
- photonics
- Photonics in Asia
- Photonics Society of India
- photovoltaics
- physical designers
- Piketown
- Pine Trail
- place-and-route technology
- Playstation 3
- PLD
- PMPs
- PNDs
- polysilicon
- Poornima Shenoy
- power
- Power Forward Initiative
- power management
- Power MOSFETs
- Powerchip
- PowerPC
- PR firms
- Pradeep Chakraborty
- Pradeep Chakraborty's Blog
- Premier Farnell
- probe cards
- processors
- Procys
- product development ecosystem
- programmable devices
- ProMOS
- PTT
- PTT-over-cellular
- PTT/PoC
- PULLNANO
- push-to-talk
- PV
- Q-Cells
- Qimonda
- QorIQ multicore platform
- quad core
- Qualcomm
- Quark Express
- Quartus II software v8.0
- Quasar
- QuickPath
- Raghu Panicker
- Rahul Deokar
- Rajeev Madhavan
- Rajeev Mehtani
- Rajiv C. Mody
- Rajiv Jain
- Raju Pudota
- Raman Research Institute
- Ramkumar Subramanian
- Ramprasad Ananthaswamy
- Randy Lawson
- Ranga Prasad
- Ranjan Das
- Ravinder Gujral
- RCG
- REACH
- Real Player
- recession
- Red Hat
- Reliance
- Renasas
- Renesas
- renewable energy
- repairs
- Research Infrastructure
- retail
- retail POS kiosk
- Rev. A
- REVA
- RF
- RF CMOS
- RF MEMS switches
- RF surveillance
- RFMD
- Rich Beyer
- RISCs
- Riverbed
- roaming
- Robert Bosch
- RoHS
- RTL
- RV Colege of Engineering
- RVCE
- S. Janakiraman
- S. Uma Mahesh
- Sachin Pilot
- Samsung Electronics
- Samsung Semiconductor
- Sandeep Mehndiratta
- Sandisk
- Sanjay Deshmukh
- Sanyo
- SAP
- SAP BusinessObjects Explorer
- Sasken
- Sathya Prasad
- Saxony
- Science
- Scott Apeland
- Scott Grant
- screens
- SDR
- search engines
- Security
- security MCUs
- Seiko
- SEMATECH
- semconductors
- SEMI
- SEMI India
- Semico
- Semico Research
- Semicon
- semicon blogs
- semicon capex
- semicon fabs
- semiconductor
- semiconductor equipment
- semiconductor equipment industry
- semiconductor equipment market
- semiconductor industry
- Semiconductor Industry Association
- semiconductor IPs
- semiconductor jobs
- semiconductor manufacturing
- Semiconductor market for PMPs
- semiconductor materials
- semiconductor policy
- Semiconductors
- semiconductors and ICs update
- Semicondutors
- SemiconWorld
- SemIndia
- Sentaurus
- Shanghai
- Shanghai processor
- Sharp
- short-range wireless
- Shweta Dash
- Si-Quest
- SIA
- Siemens
- Signet Solar
- silicon photonics
- Silicon Sensing
- silicon wafers
- simulation
- single-chip design
- SK Telecom
- Skyway Software
- smart grid
- smart meters
- smartphones
- SMB strategies
- SMEs
- SoC
- social networking
- social networking for semicon professionals
- SoCs
- SoftJin
- software developers
- solar
- solar cells
- solar ecsystem
- solar energy ecosystem
- solar fabs
- solar manufacturers
- solar modules
- solar panels
- solar photovoltaics
- solar power products
- solar/PV
- Solar; Lux Research
- Solid polymer capacitors
- solid-state hard drives
- Sony
- Sony Ericsson
- South Korea
- Spain
- Spansion
- Spartan
- spectrum
- speech-recognition
- SPIRIT
- SPMT
- SRAM
- Sriram Peruvemba
- SSDs
- SSI
- ST
- ST Micro
- ST-Ericsson
- Stanley T. Myers
- StarOffice
- STBs
- Stefan de Haan
- Stephan de Haan
- Steve Svoboda
- STM
- STM8S
- STM8S105
- STM8S207
- STMicroelectronics
- storage
- STPI
- Strategic Marketing Associates
- Stratix IV FPGAs
- Subhash Bal
- Sun
- SunFab
- Suntech
- super fuel-efficient car
- SV Probe
- Symantec
- Synopsys
- System-in-Package (SiP) solutions
- system-level chips
- systems
- Systron Donner
- Taitronics
- Taiwan
- targeted design platforms
- Tata BP Solar
- Tata Teleservices
- TCAD
- TCS
- TD-SCDMA
- TD-SCDMA Forum
- TDD
- Technology
- Technopole
- Technoprobe
- Technovation 2008
- Tejas
- Telecom
- Telecom and IT
- telecom OEMs
- telecom operators
- telecommunications
- Telefonica
- telisma
- teliSpeech 10 Indian languages
- terror attack on Mumbai
- test and measurement
- Texas Instruments India
- Text 100
- TFPV
- TFTs
- Thailand
- The Information Network
- thin film
- thin film solar
- TI
- timing analysis
- Tipping Point
- Tom Feist
- Top 10
- top 10 embedded companies in India
- TPS62601
- traffic
- TRAI
- Transport
- Trilliant
- TSIA
- TSMC
- TV panels
- TwitterJobSearch
- TwitterJobSearch.com
- UIDAI
- UK
- UK-TI
- ultra mobile broadband
- UMB
- UMC
- unified power format
- union budget
- UPA
- Upendra Patel
- UPF
- USA
- USB
- V. Srikumar
- V.R. Venkatesh
- VC funding
- VCS2009
- VDAT 2010
- Venkatesh Valluri
- Venture GES
- verification
- Verilog
- VHDL
- Vic Mahadevan
- video roaming
- Videocon
- Vietman
- Vincent Ratford
- Virtex
- Virtex-5
- virtual instrumentation
- virtualization
- Virtuoso
- Vista
- Vivek Sharma
- VLSI
- VLSI conference
- VLSI Research
- VLSI Society of India
- voice
- vPro
- VSI
- VTI
- VTU
- W-CDMA
- wafer fabs
- wafer processing equipment
- Walden C. Rhines
- WAP
- WDS
- Web 2.0
- Webdesign International Festival
- WEEE
- West Bengal
- Wi-Fi
- Widgetbox
- widgets
- WIF 2008
- WIF 2010
- WiLL
- Will Strauss
- WiMAX
- WinCE
- Wind River
- wind solutions
- Wipro
- Wipro Technologies
- wired communications
- Wireless
- wireless devices
- wireless handsets
- Wireless USB
- Wireless Week
- wireless/DSP bulletin
- WirelessHART
- wireline
- WiTECK
- Workhound
- World Cup Cricket 2011
- WSTS
- WUSB
- X-Con
- Xeon 5500
- Xilinx
- yield management
- YieldManager
- Yindusoft
- Yole
- Yole Developpement
- Yukon
- Z-RAM
- ZeBu
- ZeBu-Server
- Zetex
- ZigBee
- ZTE
Blogroll
Archives
- June 2011
- May 2011
- April 2011
- March 2011
- February 2011
- January 2011
- December 2010
- November 2010
- October 2010
- September 2010
- August 2010
- July 2010
- June 2010
- May 2010
- April 2010
- March 2010
- February 2010
- January 2010
- December 2009
- November 2009
- October 2009
- September 2009
- August 2009
- July 2009
- June 2009
- May 2009
- April 2009
- March 2009
- February 2009
- January 2009
- December 2008
- November 2008
- October 2008
- September 2008
- August 2008
- July 2008
- June 2008
- May 2008
- April 2008
- March 2008
- January 2008
- December 2007
- November 2007
- October 2007
- September 2007
- August 2007
- July 2007
- June 2007
- May 2007
- April 2007
- March 2007
Great, thank you for the post.